MR18R1624AF0-CM8 UPORABA,VEZJA,FUNKCIJA

MR18R1624AF0-CM8 Datasheet PDF

Proizvajalec	Pakiranje	Opis	PDF	Temperatura
Samsung semiconductor		(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V	MR18R1624AF0-CM8 PDF	Min°C \| Max°C

Samsung semiconductor MR18R1624AF0
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
Samsung semiconductor MR18R1624AF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R1624AF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R1624AF1-CN9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R1624AF1-CT9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V