MR18R162GAF0-CN9 UPORABA,VEZJA,FUNKCIJA

MR18R162GAF0-CN9 Datasheet PDF

Proizvajalec	Pakiranje	Opis	PDF	Temperatura
Samsung semiconductor		(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V	MR18R162GAF0-CN9 PDF	Min°C \| Max°C

Samsung semiconductor MR18R162GAF0
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
Samsung semiconductor MR18R162GAF0-CK8
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
Samsung semiconductor MR18R162GAF0-CM8
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R162GAF0-CN9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
Samsung semiconductor MR18R162GAF0-CT9
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V