MR18R326GAG0-CM8 UPORABA,VEZJA,FUNKCIJA
MR18R326GAG0-CM8 Datasheet PDF
| Proizvajalec | Pakiranje | Opis | Temperatura | |
|---|---|---|---|---|
| SAMSUNG[Samsung semiconductor] | (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V |
MR18R326GAG0-CM8 PDF | Min°C | Max°C |
- SAMSUNG[Samsung semiconductor] MR18R326GAG0
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V - SAMSUNG[Samsung semiconductor] MR18R326GAG0-CM8
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V - SAMSUNG[Samsung semiconductor] MR18R326GAG0-CT9
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V
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